EMBC 2018

When: 17/07/2018 - 21/07/2018
Where: Honolulu, Hawaii
Submission deadline 4 Feb 2018

The IEEE Engineering in Medicine and Biology Society is pleased to announce the 40th International Engineering in Medicine and Biology Conference, to be held in Honolulu, Hawaii from July 17-21, 2018. The theme of the meeting is “Learning from the Past, Looking to the Future”, inspired by the 40th anniversary of the world’s largest international biomedical engineering meeting. 

Consistent with the theme, the conference organisers have arranged plenary keynotes from leading industrial and academic scientists, who will give forward looking visions as well as historical perspectives on our field. A broad array of scientific tracks will cover diverse topics of cutting-edge research and innovation in biomedical engineering, healthcare technology R&D, translational clinical research, technology transfer and entrepreneurship, and biomedical engineering education. 

In addition to the high-profile keynotes, the conference program will feature  mini symposia, workshops, invited sessions, oral and poster sessions, sessions for students and young professions, sessions for clinicians and entrepreneurs, and exhibits from vendors and universities. 

Organizing Committee

Conference Chair – James Weiland, University of Michigan

Conference Chair – Michelle Khine, University of California-Irvine 

Finance Chair – Thomas Penzel, Charite Universitätsmedizin Berlin

Program Chair – Gregg Suaning, University of Sydney 

Program Co-Chair – Olaf Doessel, Karlsruhe Institute of Technology (KIT)

Conference Editorial Board Chair – James Patton, University Illinois at Chicago

Workshop Chair – Atam Dhawan, New Jersey Institute of Technology 

Local Organizing Committee Chair – Aaron Ohta, University of Hawaii

Exhibits-Sponsorship Chair – Jack Judy, University of Florida

WIE Chair – Lisa Lazareck-Asunta, Wellcome Trust 

WIE Chair – Jennifer Shin Park, KAIST

Webmaster – Hans van Oostrom,van Oostrom Consulting

Executive Office – Janice Sandler, IEEE, EMB

Further information on the conference can be found here

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